Location
remote, remote, Canada
Posted
July 20, 2026
Job Description
Drive wafer-level packaging processes as a WLP Process Engineer with Teledyne Technologies. Focus on wafer bonding, tool optimization, and yield improvement in a dynamic cleanroom environment.
As part of the Uncooled Detector Production team, you'll own the WLP process line, managing diverse bonding processes like fusion and adhesive bonding. Ideal candidates should exhibit strong hands-on wafer bonding experience, enabling process stability and efficient troubleshooting. Engage in collaboration and support production ramp with a team committed to excellence.
Key Responsibilities:
• Own WLP process line and bonding processes
• Develop and optimize bonding recipes for various parameters
• Lead DOE activities to boost yield and defectivity
• Troubleshoot alignment, thermal control, and bonding defects
• Analyze process issues and implement corrective measures
Requirements:
• Bachelor's in Engineering or related te...
As part of the Uncooled Detector Production team, you'll own the WLP process line, managing diverse bonding processes like fusion and adhesive bonding. Ideal candidates should exhibit strong hands-on wafer bonding experience, enabling process stability and efficient troubleshooting. Engage in collaboration and support production ramp with a team committed to excellence.
Key Responsibilities:
• Own WLP process line and bonding processes
• Develop and optimize bonding recipes for various parameters
• Lead DOE activities to boost yield and defectivity
• Troubleshoot alignment, thermal control, and bonding defects
• Analyze process issues and implement corrective measures
Requirements:
• Bachelor's in Engineering or related te...