Location
kulim, kedah, Malaysia
Posted
June 02, 2026
Job Description
Intel is seeking a Packaging Module Development Engineer in Kulim, Malaysia, to drive innovation in Thermal Compression Bonding for advanced packaging. This role demands a Master’s degree and offers opportunities to enhance assembly processes, analyze data, and collaborate across teams.
Ideal candidates will have experience with data science tools and mechanical design. Join Intel to impact semiconductor technology while working in a collaborative environment.
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