Location
kulim, kedah, Malaysia
Posted
June 05, 2026
Job Description
Job Description
The Role and Impact:
- Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
- In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages.
- With an emphasis on experimentation, data analysis, and collaboration, you'll support Intel's mission to deliver world-class products that empower global innovation.
- This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry.
Key Responsibilities
- Develop and optimize assem...