Technology Development Engineer (Advanced Packaging)

UNITED MICROELECTRONICS CORPORATION (Singapore Branch)

Full-time Other-General
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Location
singapore, singapore, Singapore
Posted
June 27, 2026

Job Description

We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners. This role will focus on advanced packaging technologies, ensuring high-quality, cost-effective, and timely product delivery while collaborating with cross-functional team.

Job Responsibilities:

  • Work on 2.5D/3D packaging platform technologies.
  • Develop bump, underfill, molding and RDL processes.
  • Collaborate with internal R&D and OSAT partners to drive Heterogeneous Integration.
  • New advanced packaging process verification and qualification.
  • Customer engagement and new product verification

Capability

  • Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
  • Experienced in 2.5D and 3DIC process development are plus.
  • Skill on FMEA, control plan, DOE (design of experiment) and problemsolvin...