Job Description
Kandou AI is redefining the economics of AI infrastructure. Our proprietary MIMO‑over‑copper technology powers a high‑performance, chiplet‑based AI memory fabric that delivers high bandwidth and ultra‑low latency at dramatically lower power. Our architecture represents a foundational shift in how next‑generation AI hardware is built.
We are seeking a Technical Advisor / Principal Architect to work directly with the CTO on the conception, modeling, and development of breakthrough communication and interconnect technologies.
This is a rare opportunity for an engineer who thrives at the intersection of theory, architecture, and silicon implementation — someone who wants to help shape the future of chip‑to‑chip, die‑to‑die, memory, and networking interconnects.
Role Overview
You will partner closely with the CTO to explore, evaluate, and prototype next‑generation communication system architectures. This role spans research, modeling, algorithm developme...