Location
Phoenix, AZ, United States
Posted
July 13, 2026
Job Description
**Job Details:**
**Job Description:**
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
+ Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
+ Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
+ Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
+ Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
+ Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, proce...
**Job Description:**
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
+ Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
+ Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
+ Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
+ Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
+ Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, proce...