Location
ipoh, perak, Malaysia
Posted
June 04, 2026
Job Description
Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
Key Responsibilities
- Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
- Ramp up manufacturing volume and qualify required sources.
- Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
- Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
- Manage Product Lifecycle Management documents to the latest status.
- Conduct change-management with suppliers to sustain / improve capacity and cost.
Qualifications
- Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
- Experienced in process engineering or package development of materi...