Staff Package Design Engineer- experienced in package development of power SiP/module
Renesas Electronics
full-time
Engineers
Location
Hsinchu County, Hsinchu County, Taiwan
Posted
June 21, 2026
Job Description
Job Description
- Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging.
- Strong understanding on wafer processing such as Front side of metal/Backgrind Backmetal, Taiko Backgrinding, Glass carrier bonding&grinding, Patterned back metal, Embedded die in substrate
- Package technologies qualification for consumer & industrial power as well as automotive power applications.
- Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
- Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
- Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
- Resolve all process integration issues by ensuring all window checks are done on critica...