Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Annapurna Labs (U.S.) Inc.
full-time
Engineers
Location
Austin, Texas, United States
Posted
April 12, 2026
Job Description
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
We are seeking a Sr. Package Layout Engineer to lead the end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will own the package layout from initial floor planning through tape out and manufacturing release. You'll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
We are seeking a Sr. Package Layout Engineer to lead the end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will own the package layout from initial floor planning through tape out and manufacturing release. You'll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.