Location
seremban, negeri sembilan, Malaysia
Posted
July 19, 2026
Job Description
Nexperia in Malaysia is seeking a Senior Wire Bond Equipment & Process Engineer to optimize semiconductor wire bonding processes, improve yield and reliability, and work with R&D, process engineering, and manufacturing teams.
You will lead equipment setup, qualification, and optimization, analyze data for improvements, and mentor junior engineers while ensuring safety and quality standards are met.
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