Location
ipoh, perak, Malaysia
Posted
June 12, 2026
Job Description
II-VI UK, Ltd. is seeking a qualified professional in Ipoh, Malaysia to improve and sustain the Die Attach & Wire Bond Process. The candidate will collect data to generate engineering reports and ensure the assembly yield meets KPI targets.
Successful candidates should possess a Bachelor's degree in Engineering, ideally in Electronics. Experience in high volume manufacturing and strong analytical skills are essential for this full-time onsite role.
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