Location
malacca city, malacca, Malaysia
Posted
July 13, 2026
Job Description
Your Role
Key responsibilities in your new role
- PBC and TPC assessment.
- Driver of Package Technology DFMEA Process of Record.
- Owner of Risk Interaction assessment and mitigation work packages.
- Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow.
- Working partner for FE in FE/BE interaction and integration topics.
- Support Pre development for new Chip technology.
Your Profile
Qualifications And Skills To Help You Succeed
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge.
- Good aptitude for communication, collaboration, negotiation and solution finding.
- Knowled...