Location
kulim, kedah, Malaysia
Posted
July 10, 2026
Job Description
Intel is seeking a Silicon Packaging Design Engineer in Kulim, Malaysia. This position involves driving substrate design processes, collaborating with teams to enhance product performance, and utilizing advanced design tools.
Ideal candidates will have a Bachelor’s degree in Engineering and a minimum of 4 years of experience in substrate/package design, showcasing strong problem-solving and collaboration skills.
This role supports a hybrid work model and emphasizes innovation and continuous learning within Intel's industry-leading team.
#J-18808-Ljbffr