Location
singapore, singapore, Singapore
Posted
June 23, 2026
Job Description
Qualcomm is seeking a Senior Technical Specialist to drive RF Front End Modules innovation in Singapore. This role involves leading technology integration and managing wafer-level assembly processes within a global team, ensuring robust production and quality.
Applicants should have a Master’s degree and extensive experience in semiconductor packaging. The ideal candidate will demonstrate leadership in developing packaging solutions and collaborating across multiple functions.
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