Senior R&D Engineer, Advanced Packaging & IC Integration
Broadcom Inc.
Full-time
IT Management & IT Project Management
Location
singapore, singapore, Singapore
Posted
May 31, 2026
Job Description
Broadcom Inc. in Singapore is seeking an experienced engineering professional to lead IC packaging activities for advanced silicon products. Candidates should have a strong background in signal integrity, project management, and advanced packaging technologies
The ideal candidate will possess a BS/MS/PhD and 8+ years of industry experience. This role emphasizes collaboration with design teams and understanding of advanced materials and processes.
Broadcom is an equal opportunity employer committed to diversity and inclusion in the workplace.
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