Location
batu kawan, penang, Malaysia
Posted
July 09, 2026
Job Description
Sandisk seeks an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. The role integrates with CPI Failure Analysis and collaborates with wafer fabrication, package design, assembly R&D, and characterization teams.
The position focuses on improving device reliability, leading package evaluation for NAND/ASIC, and informing design decisions through detailed failure analysis.
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