Location
batu kawan, penang, Malaysia
Posted
July 21, 2026
Job Description
Sandisk is seeking a Senior Packaging Engineer (Mechanical Development) in Malaysia to drive mechanical development for SSD packaging. You will run DOEs, perform RCCA, and lead DFMA review across design packages and fixtures.
Expect collaboration with cross‑functional teams to ensure robust product qualification and manufacturing readiness. The role requires a Mechanical Engineering degree and 3–8 years in the semiconductor/automation field, with strong skills in DOE, FMEA, DFMA, and CAD tools.
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