Location
seremban, negeri sembilan, Malaysia
Posted
June 22, 2026
Job Description
Nexperia is seeking a technical leader for the Package Development team to lead backend assembly and package platform development. This role involves strategic definition, execution of technology roadmaps, and management of cross-functional collaboration, as well as coaching team members to enhance their technical capabilities.
The ideal candidate will have a Master’s degree in Engineering, a minimum of 10 years of experience in the semiconductor industry, and strong leadership and technical skills related to packaging processes.
#J-18808-Ljbffr