Senior Manager, Die Bond Product Engineering

ITEC Equipment

Full time Operations Specialties Managers
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Location
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
Posted
July 26, 2026

Job Description

About the role:

If you are passionate about pushing technical boundaries while leading teams to deliver real impact in the field, this is your opportunity to make it happen.

We are looking for a driven Die Bond Product Engineering Manager to lead the next generation of die attach technology, shaping how our equipment performs in real customer applications. In this role, you will own the intersection of machine innovation, process expertise, and customer success, turning complex semiconductor requirements into cutting‑edge, high‑performance solutions.


What You will Be Doing:

  • Own the process application and performance of the die bonder product portfolio across key packaging segments
  • Define product requirements, use‑case scenarios, and application benchmarks for new platforms or modules
  • Lead die attach development, qualification, and NPI ramp to high‑volume manufacturing
  • Drive yield, reliability, and downtime reductio...

    • Job Details

    • Job Type
      Full time
    • Category
      Operations Specialties Managers
    • Date Posted
      July 26, 2026
    • Application Deadline
      September 04, 2026