Location
malacca city, malacca, Malaysia
Posted
June 08, 2026
Job Description
Infineon Technologies in Malacca seeks a Lead Frame/Packing Material Development Engineer to drive packaging development activities and ensure compliance with manufacturing and quality standards.
The ideal candidate will have a Bachelor’s Degree in Engineering with at least 8 years of relevant experience, particularly in semiconductor assembly and packing, alongside strong skills in AutoCAD and 3D design.
#J-18808-Ljbffr