Senior High‑Speed Package Design Engineer (SerDes, Flip-Chip BGA)
Broadcom Inc.
Full-time
Other-General
Location
singapore, singapore, Singapore
Posted
July 03, 2026
Job Description
Broadcom Inc. is looking for an experienced package design engineer in Singapore. The engineer will be responsible for designing complex flip-chip BGA packages for high-speed SerDes and RF/microwave ASICs. This role emphasizes collaboration within a worldwide R&D team working on advanced technologies such as AI, HPC, and 5G.
The ideal candidate will have a degree in Electrical Engineering and significant experience in package design, particularly in high-speed applications. Preferred experience includes working with Cadence APD and managing multiple projects effectively.
#J-18808-Ljbffr