Location
, penang, malaysia, penang, Malaysia
Posted
July 26, 2026
Job Description
FusionAP in Malaysia is seeking a Senior Principal Technology Development Engineer to own the heat spreader attachment and TIM assembly. You will bridge materials science with precision dispensing to ensure reliable thermal pathways in high‑performance packaging.
The role requires 10+ years in semiconductor process engineering, deep experience with lidding and TIM/adhesive dispensing, and a proven ability to drive DOE, SPC, and pFMEA in a fast‑paced environment. Travel minimal.
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