Location
seremban, negeri sembilan, Malaysia
Posted
July 11, 2026
Job Description
About the role
This role is responsible for end-to-end ownership of both process and equipment performance for Die Bond and Wire Bond stations in a Reel-to-Reel (R2R) semiconductor assembly line. The engineer plays a critical role in ensuring high equipment uptime, process stability, yield improvement, and quality excellence in a high-volume manufacturing environment. The position requires strong technical hands‑on capability, data‑driven problem solving, and close collaboration with cross‑functional teams. The engineer will act as a key technical owner, driving continuous improvement, supporting new product introductions, and implementing robust controls to prevent process and equipment‑related failures.
What You Will Do
- Own and sustain Die Attach and Wire Bond processes and equipment, ensuring stable operation, high OEE, and compliance with process specifications.
- Manage tooling setup, calibration, alignment, and qualification activities. ...