Senior Engineer / Principal Engineer / Member of Technical Staff, Analog / Mixed-signal Design Architect, Next-generation HBM Architecture
Micron Technology, Inc.
Full-time
other-general
Location
Folsom, CA, United States
Posted
July 11, 2026
Job Description
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications.
As a Senior Engineer, Principal Engineer, or Member of Technical Staff, Design Architect in the Next-generation HBM Architecture Team, you will design, simulate, analyze, and optimize the architecture of 3D-stacked, high-performance memories. Apply your knowledge to explore trade-offs in 3D-stacked logic and memo...
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications.
As a Senior Engineer, Principal Engineer, or Member of Technical Staff, Design Architect in the Next-generation HBM Architecture Team, you will design, simulate, analyze, and optimize the architecture of 3D-stacked, high-performance memories. Apply your knowledge to explore trade-offs in 3D-stacked logic and memo...