Location
singapore, singapore, Singapore
Posted
July 03, 2026
Job Description
Bitdeer Group in Singapore is seeking a specialist in 3DIC and advanced packaging to define the TSV/hybrid-bond interface. The ideal candidate will manage various aspects of 3D integration and work closely with cross-functional teams to ensure successful tapeouts.
Candidates should have considerable experience in thermal-mechanical behavior and a solid grasp of the 3D ecosystem. This role offers the opportunity to be part of a fast-growing company with a vibrant start-up spirit and attractive welfare benefits.
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