Semiconductor Packaging Strategy & Assembly Lead

Nexperia

Full-time Engineering
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Location
seremban, negeri sembilan, Malaysia
Posted
June 22, 2026

Job Description

Nexperia in Seremban, Malaysia, is seeking an experienced leader to define and execute technology roadmaps in semiconductor packaging. You will drive the development of packaging solutions and coach a team to overcome technical challenges.

The ideal candidate should have at least 10 years in the semiconductor industry, including managerial experience. A comprehensive understanding of assembly processes and technology is crucial for this role, which promotes a culture of continuous learning and development.

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