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Location
Hamburg, Hamburg, Germany
Posted
July 03, 2026

Job Description

What you will do

  • Work in an engaged multi-cultural team with global footprint, co-operate with internal and external development and production partners
  • Having as Package Architect the leading responsibility for functionality and performance of Semiconductor Packages
  • Interfacing to global package and assembly development community
  • Collect technical customer needs, market trends and benchmarking information
  • Propose own innovative solutions
  • Support all Business Group functions package expertise
  • Pro-active Package Requirements Management and road-mapping derived from product roadmaps and market trends

    • What you will need

  • Master’s degree or PhD in Semiconductor Packaging, Chemistry, Physics, Materials Technology, Mechanical Engineering or similar
  • Preferably first relevant experience, depending on educational credentials
  • Strong skills in architectural thinking, critical judgement and fast an...

    • Job Details

    • Job Type
      Full time
    • Category
      Engineers
    • Date Posted
      July 03, 2026
    • Application Deadline
      August 12, 2026