Semiconductor Hermetic Packaging Process Engineer

Lockheed Martin

Full-time Engineers
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Location
United States, California, United States
Posted
June 14, 2026

Job Description

Job Description

You will be the Semiconductor Hermetic Packaging Process Engineer for the Semiconductor Packaging Team. Our team is responsible for advancing hermetic packaging solutions for infrared sensor modules.



What You Will Be Doing


As the Semiconductor Hermetic Packaging Process Engineer you will be responsible for developing, qualifying, and sustaining dewar process modules that enable high‑yield production of IR sensors.



Your responsibilities will include, but are not limited to:



  • Define, develop, and transfer hermetic‑packaging processes for IR sensor modules.

  • Own equipment lifecycle, including capital identification, qualification, validation, and preventive maintenance.

  • Write and maintain process work instructions, operational instructions, and inspection plans.

  • Conduct statistical process control, capability assessments, and continuous monito...

    • Job Details

    • Job Type
      Full-time
    • Category
      Engineers
    • Date Posted
      June 14, 2026
    • Application Deadline
      July 24, 2026