Research Engineer, Process Modules, APM, IME

Full-time Other-General

Research Senior Engineer - Wafer-to-Wafer Bonding Engineer (APM)

Advance the Next Generation of Semiconductor Packaging

We are seeking a motivated Wafer-to-Wafer Bonding Engineer to join our multidisciplinary R&D team to support the development of advanced wafer bonding technologies for next-generation semiconductor packaging. This role involves hands‑on process development, wafer characterization, and close collaboration with cross‑functional teams to enable innovative packaging solutions.

Key Responsibilities

• Development and optimization of wafer‑to‑wafer bonding processes, including hybrid bonding and temporary bonding/debonding.
• Execute process DOE to improve process performance, yield, and reliability.
• Perform wafer inspection and characterization using metrology and failure analysis techniques.
• Investigate process issues and implement corrective actions through systematic data analysis and root‑cause investiga...