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Location
Seremban, Negeri Sembilan, Malaysia
Posted
July 12, 2026

Job Description

Process Sustaining Engineer (Die Attach/DACA Engineering)
 

Job Summary

Support stable Die Attach manufacturing by maintaining process capability, improving yield and reducing defects.


What you need to do:

  • Monitor process performance.
  • Investigate yield excursions.
  • Perform defect analysis.
  • Conduct DOE.
  • Update work instructions.
  • Support engineering evaluations.
  • Analyze SPC trends.
  • Reduce process variation.
  • Support customer qualifications.


    • What you need to have:

  • Bachelor's Degree in Engineering.
  • 1–5 years semiconductor experience.
  • Knowledge of Die Attach process.
  • Familiar with JMP, SPC and Minitab.

    • Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

    D&...

    Job Details

    • Job Type
      Full time
    • Category
      Engineers
    • Date Posted
      July 12, 2026
    • Application Deadline
      August 21, 2026