Location
seremban, negeri sembilan, Malaysia
Posted
July 12, 2026
Job Description
Job Summary
Support stable Die Attach manufacturing by maintaining process capability, improving yield and reducing defects.
Responsibilities
- Monitor process performance.
- Investigate yield excursions.
- Perform defect analysis.
- Conduct DOE.
- Update work instructions.
- Support engineering evaluations.
- Analyze SPC trends.
- Reduce process variation.
- Support customer qualifications.
Qualifications
- Bachelor's Degree in Engineering.
- 1–5 years semiconductor experience.
- Knowledge of Die Attach process.
- Familiarity with JMP, SPC and Minitab.
Equal Opportunity Employment
As an equal‑opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and provide a safe work environment and reasonable adjustments wher...