Location
kampung sekolah simpang ampat, penang, Malaysia
Posted
June 27, 2026
Job Description
Job Description
- Develop and optimize burn‑in test procedures for semiconductor devices, components, or systems.
- Support designing burn‑in boards, fixtures, and test hardware.
- Analyze burn‑in data to identify failure trends and root causes.
- Define burn‑in conditions (temperature, voltage, duration, stress levels) according to product requirements.
- Troubleshoot hardware and process issues in burn‑in operations.
- Support qualification and reliability testing (HTOL, HAST, temperature cycling, etc.).
- Ensure compliance with industry standards (JEDEC, MIL‑STD, IPC).
- Automate data collection and reporting for yield and reliability analysis.
- Develop, program, and optimize AOI inspection programs for PCB assemblies.
- Set up and maintain AOI equipment (2D/3D inspection systems).
- Analyze defect data and improve detection capability while reducing false rejects.
- Troubles...