Process Engineer: Semiconductor Packaging & Back‑End
Tampere University
Full-time
Plastics & Process Engineering
Location
tampere, manner suomi, Finland
Posted
June 22, 2026
Job Description
Tampere University is looking to fill up to three Process Engineer roles at SiPFAB focused on next-generation semiconductor packaging. You will lead the development of key processes like flip-chip bonding and encapsulation. This role involves collaboration with academia and industry on innovative projects.
The ideal candidate will have a Master's or Ph.D. in a relevant field and at least three years of experience in semiconductor technologies. A hands-on approach and strong problem-solving skills are essential. A flexible work environment and competitive benefits are offered.
#J-18808-Ljbffr