Location
Ithaca, NY, United States
Posted
July 15, 2026
Job Description
Wafer Fab Process Engineer will work in the class 100 semiconductor facility and will perform multiple operations including: cleaning and coating wafers; aligning wafers using mask aligners, metal/dielectric deposition and etching, baking and annealing, inspections, performing tool calibrations, carry out DOE runs analyze and report data.
Working hours will be 10:00am – 7:00pm with flexibility to cover portion of the second shift as needed
Experience:
Candidate must have 2+ years experience with contact/stepper lithography, e-beam evaporation/ Sputtering, lift-off process, RTP, Furnace anneal, ALD, PECVD of SiO2 and Si3N4 and RIE/ICP processes of dielectrics and semiconductors materials.
Education:
BS in Science, Engineering or equivalent.
Working hours will be 10:00am – 7:00pm with flexibility to cover portion of the second shift as needed
Experience:
Candidate must have 2+ years experience with contact/stepper lithography, e-beam evaporation/ Sputtering, lift-off process, RTP, Furnace anneal, ALD, PECVD of SiO2 and Si3N4 and RIE/ICP processes of dielectrics and semiconductors materials.
Education:
BS in Science, Engineering or equivalent.