Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
Intel
Full-time
Engineering
Location
kulim, kedah, Malaysia
Posted
June 13, 2026
Job Description
Job Description
- Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.
- Conducts tests and measurements of operations to ensure control over critical dimensions and defectivity of the process line.
- Recommends and implements modifications for operating the equipment to improve production efficiencies, manufacturing techniques, and optimizing production output for existing products, to meet safety, quality and cost indicator goals.
- Grows inβsitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.
- Owns execution of maintenance and repair activities for equipment and relevant modules of components.
- Initiates and owns the continuous improvement of equipment and process for key performance indi...