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Location
Seremban, Negeri Sembilan, Malaysia
Posted
June 29, 2026

Job Description

Lead product engineering activities for Advanced Power Modules in the New Product Development (NPD) division. This role focuses on developing next-generation power modules using advanced embedded packaging technologies, such as chip embedding and interposer-based integration, to achieve high performance and reliability. You will ensure manufacturability, quality, and robustness through prototype builds, qualification runs, and validation processes, collaborating with global cross-functional teams to deliver automotive-grade solutions.

  • Prototype & Qualification Builds Plan and execute prototype and qualification runs for embedded power modules, ensuring compliance with NPD phase-gate requirements. Validate build integrity and maintain accurate documentation of process parameters and outcomes.
  • Advanced Embedded Packaging Apply expertise in chip embedding, interposer integration, and thermal/electrical optimization for module development. Perform process...

    • Job Details

    • Job Type
      Full time
    • Category
      Engineers
    • Date Posted
      June 29, 2026
    • Application Deadline
      August 08, 2026