Location
Suzhou, China, China
Posted
July 25, 2026
Job Description
Major Accountabilities:
+ Responsible for leading automative SiC/IGBT Power Switch (Module) development from R&D to mass production including pre-research design & verification, technical implementation, development progress handling and mass production implementation,
+ Responsible for collaborating with wafer suppliers to customize IGBT/SiC Die development and solve technical and process issues in development,
+ Responsible for handling verification plan of electrical performance and reliability validation from R&D to mass production and solving issues in electrical characteristics, thermal characteristics and reliability validation,
+ Collaborate with teams in electrical simulation to ensure that performance on the design path complies with theoretical targets,
+ Collaborate with teams in development and optimization of new products with well ability cross-function collaboration,
+ Collaborate with teams in evaluation of advance technologies in packaging and chip d...
+ Responsible for leading automative SiC/IGBT Power Switch (Module) development from R&D to mass production including pre-research design & verification, technical implementation, development progress handling and mass production implementation,
+ Responsible for collaborating with wafer suppliers to customize IGBT/SiC Die development and solve technical and process issues in development,
+ Responsible for handling verification plan of electrical performance and reliability validation from R&D to mass production and solving issues in electrical characteristics, thermal characteristics and reliability validation,
+ Collaborate with teams in electrical simulation to ensure that performance on the design path complies with theoretical targets,
+ Collaborate with teams in development and optimization of new products with well ability cross-function collaboration,
+ Collaborate with teams in evaluation of advance technologies in packaging and chip d...