Location
Shanghai, Shanghai, China
Posted
July 23, 2026
Job Description
Job Description
Qualifications
- Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications.
- Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module.
- Conduct PDN extraction for the module package to assess power path losses and switch-node ringing.
- Design inductors per module and silicon pinmap. Work with inductor vendors to bring concept designs into real products.
- Build and run module thermal models to ensure all components remain below maximum operating temperatures.
- Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance.
- Support design-for-manufacturing (DFM) and design-for-test (DFT) activities.
Qualifications
- BSEE or MSEE with 5+ years of hand...