Location
kulim, kedah, Malaysia
Posted
July 18, 2026
Job Description
Intel Corporation in Malaysia is seeking a Process Development Engineer to advance solder ball attach or chip attach processes for electronic packaging. You will develop process specifications, perform DOEs, and document improvements while collaborating with cross-functional teams to optimize yield and reliability.
The role requires 5+ years in electronic packaging, a strong data-analysis background, and hands-on experience with chip attach/ball attach technologies.
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