Location
kulim, kedah, Malaysia
Posted
July 22, 2026
Job Description
Intel in Malaysia, Kulim seeks a Process Development Engineer to advance solder ball attach or chip attach processes within the Technology Development Organization. You will work on die and DRAM attach, component attach, solder ball attach, and deflux processes, developing manufacturing-ready solutions for new products and test vehicles.
You will apply DOE, SPC, and FMEA to drive process development, quality, yield, and cost improvements, collaborate with cross-functional teams, and transfer
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