Location
Phoenix, AZ, United States
Posted
June 03, 2026
Job Description
**Job Details:**
**Job Description:**
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies. Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
Develops process and equipment specifications using principles of design of experiments (DOE), data analysis, and statistical methods to support process development and continuous improvement initiatives. Documents technical findings, improvements, and best practices through technical reports and white papers.
Develops, maintains, and evaluates equipment and processes used to assess silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. ...
**Job Description:**
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies. Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
Develops process and equipment specifications using principles of design of experiments (DOE), data analysis, and statistical methods to support process development and continuous improvement initiatives. Documents technical findings, improvements, and best practices through technical reports and white papers.
Develops, maintains, and evaluates equipment and processes used to assess silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. ...