Packaging Module Development Engineer – NPI & Assembly Expert
Intel Corporation
Full-time
Engineering
Location
kulim, kedah, Malaysia
Posted
June 08, 2026
Job Description
Intel Corporation is seeking a Package Module Development Engineer located in Kulim, Kedah, Malaysia. In this role, you will define and establish process flow, conduct FMEA assessments, and develop solutions for various challenges during the development cycle.
The ideal candidate will have a Bachelor or Master’s degree, and 3+ years in process development within the semiconductor field. Experience with statistical design techniques and data sciences will be beneficial.
This position requires on-site presence to ensure effective support in new factory start-ups and material development processes.
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