Location
kulim, kedah, Malaysia
Posted
June 04, 2026
Job Description
Job Details
Job Description
- Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization.
- CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process.
- Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product.
- Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization.
- Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
- Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
- Optimizes and improves ...