Location
kuala lumpur, kuala lumpur, Malaysia
Posted
June 30, 2026
Job Description
Texas Instruments is seeking a Packaging Engineer in Kuala Lumpur, Malaysia. This role offers participation in the Career Accelerator Program, providing professional training to develop packaging technologies for semiconductor solutions.
You will collaborate with cross-functional teams, engage in product qualification, and conduct various engineering models to enhance packaging reliability. We seek candidates with a relevant engineering degree and strong analytical skills.
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