Packaging Development Engineer

NXP Semiconductors

Full-time Engineering
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Location
kuala lumpur, kuala lumpur, Malaysia
Posted
July 18, 2026

Job Description

NXP Semiconductors N.V.

Responsibilities

  • Lead, plan, and execute projects related to process assembly development and validation.
  • Design, execute, and analyze process related experiments.
  • Use software to analyze data including statistical analysis.
  • Solve process issues using creative problem solving techniques.
  • Create process recipe for packaging development, qualify and transfer for high volume production.
  • Set up new specifications and procedures for production.
  • Initiate sharing of lesson learnt and best practices among manufacturing sites.
  • Lead / participate in Task Force Teams.
  • Identify risks and actions for risk mitigation manufacturing operation.
  • Lead / support process qualification activities.

Requirements

  • Minimum Bachelor’s degree in Engineering or Sciences (or related field).
  • Master or PhD holder is preferred.
  • Good aptitude in...