Package Health Engineer

Micron

Full-time Engineers
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Location
Taiwan, Taichung City, Taiwan
Posted
June 28, 2026

Job Description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Key Responsibilities 

  • Develop and implement DFT strategies for advanced packaging. 
  • Conduct simulations for mechanical, thermal, and electrical performance. 
  • Perform electrical and mechanical characterization of packages. 
  • Analyze test and field data to identify early indicators of package degradation. 
  • Collaborate with data scientists to build predictive models for package health. 
  • Support root cause analysis and corrective actions for reliability issues. 


    • Qualifications 

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. 
  • 2+ years of experience in se...

    • Job Details

    • Job Type
      Full-time
    • Category
      Engineers
    • Date Posted
      June 28, 2026
    • Application Deadline
      August 07, 2026