Location
Austin, TX, United States
Posted
June 15, 2026
Job Description
Staff Package Design Engineer
Job Description
In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.
**Key Responsibilities**
+ Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
+ Develop and...
Job Description
In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.
**Key Responsibilities**
+ Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
+ Develop and...