Location
ottawa, on, Canada
Posted
June 01, 2026
Job Description
About the Role
Design and develop advanced packaging solutions for photonic devices and optical components powering next‑generation communication systems and HPC. Define architectures, optimize thermal/mechanical performance, and ensure reliability.
Responsibilities
- Design/implement optomechanical packages; create drawings/specs/test plans.
- Analyze process flows; perform thermal/mechanical tests; drive reliability/failure analysis.
Qualifications
- Bachelor’s/Master’s in ME/Materials/Optical Eng.; experience in optical/photonics packaging; CAD (SolidWorks/AutoCAD); simulation (ANSYS/COMSOL).