Location
remote, remote, Brazil
Posted
July 08, 2026
Job Description
Responsibilities:
- new semiconductor package project implement on Memory product ( DRAM, Flash, LPDDR, eMMC, UFS) in Sao Paulo, Brazil.
- Link China customer requirement spec with Process engineering for the new product implement.
- Coordinate with PM、RD、QA, supplier team, make sure engineering mission and project running on schedule.
- Support the qualification reliability test verification items and fail sample Failure analysis.
- Support engineering verification, process issue analysis and quality improvement.
- Support to engineering team to communicate with China, Taiwan material and machine vendor in Chinese.
Requirement:
- Have NPI or semiconductor package process experience more than 5 years.
- Know the NPI, engineering verification, product implement or process improvement flow.
- Have semiconductor package process, reliability test, yield improvement...