Location
kulim, kedah, Malaysia
Posted
May 27, 2026
Job Description
Intel is seeking an experienced professional in Kulim, Malaysia, focused on developing assembly processes for semiconductor packaging. The ideal candidate possesses a MSc/PhD in a relevant engineering field, with at least 3 years of experience. Key responsibilities include optimizing manufacturing efficiency and ensuring quality standards throughout the packaging process.
This role requires regular onsite presence and offers a valuable opportunity to contribute to Intel's innovative roadmap in semiconductor technologies.
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